solder bump lead

solder bump lead
lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m

Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. . 2000.

Игры ⚽ Нужен реферат?

Look at other dictionaries:

  • solder bump pad — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …   Radioelektronikos terminų žodynas

  • Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

  • Lötkontakthügel — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …   Radioelektronikos terminų žodynas

  • lydmetalinis gūburinis išvadas — statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …   Radioelektronikos terminų žodynas

  • poutre de brasure — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …   Radioelektronikos terminų žodynas

  • столбиковый вывод из припоя — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …   Radioelektronikos terminų žodynas

  • Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

  • Radio-frequency identification — (RFID) is a technology that uses radio waves to transfer data from an electronic tag, called RFID tag or label, attached to an object, through a reader for the purpose of identifying and tracking the object. Some RFID tags can be read from… …   Wikipedia

Share the article and excerpts

Direct link
Do a right-click on the link above
and select “Copy Link”